Numerical Studies on Heat Transfer Behavior of Electronics Module with Zr, SiC and Cu Water Based Nanofluids
Keywords:
Electronics Module, Simulation, Nanofluids, Water-Zr, Water-SiC, Water-Cu.Abstract
Normal air cooling method is not pertinent for high heat flux electronics apparatuses. For that, the thermal investigation of electronics module is really indispensable towards its hassle free operation. The present study involves an electronics module kept horizontally at the base, inside a square shaped chamber filled with nanofluid as coolant. Three different water based nanofluids, specifically Water-Zr, Water-SiC and Water-Cu, are considered as coolants in the present investigations. The numerical studies are performed to obtain the heat transfer behavior of electronics module for maintaining its temperature within the safe limit. For that, a 2D numerical model is being developed which also includes thermal buoyancy. The continuity, momentum and energy equations are solved to predict the thermal behavior. Simulations are conducted to predict the temperature fields and temperature contours. The trends of results are along the expected lines. Simulation results predicted with three different water based nanofluids are analyzed and compared for realizing the relative importance of the stated nanofluids. The key model parameter considered is heat flux of 70 W/cm2 associated with the electronics module. The Water-SiC is witnessed as the nanofluid delivering comparatively greater cooling behavior towards electronics module with no such failure as a result of heat.
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