Development of Closed-Form Solution for a Multi-Layered Composite Stack Subjected to Thermal Loads

Authors

  • Sanidhya Kumar Sanu  Department of Mechanical Engineering, PES University, Bangalore, Karnataka, India
  • B K Karthik  Department of Mechanical Engineering, PES University, Bangalore, Karnataka, India
  • Vijay Vittal  Department of Mechanical Engineering, PES University, Bangalore, Karnataka, India
  • B Rammohan  Department of Mechanical Engineering, PES University, Bangalore, Karnataka, India

Keywords:

Composite laminate, Uniform thermal load, ILSS, Closed-form, Unidirectional lamina, and Multilayered stack

Abstract

Design and assessment of thermal stresses in multi-layered composites has always been area of major concern, as delamination/debonding of the laminae poses a serious issue in the failure of the laminate structure. Stresses at interface can be obtained more swiftly by analytical method when compared to finite element method. In the current work, a comparison has been made between finite element model and first order approximated analytical formulae derived using classical plate theory for a cantilever beam type composite laminate structure with orthotropic material properties. A three-layered structure with orthotropic material properties subjected to uniform thermal load is presented. A comparison has been made among obtained results, Ansys results and the results from similar work carried out in published journal paper. Results obtained from the present work was found to be in close comparison to the Ansys results, stating quantitatively 10.7% from the Ansys results calculated at interface-2, while qualitatively both of them follows the similar trend.

References

  1. Timoshenko, S., 1925, "Analysis of Bi-Metal Thermostats", J. Opt. Soc. Am., 11, pp. 233-255.
  2. Grimado, P. B., 1978, "Interlaminar Thermoelastic Stresses in Layered Beams", J. Therm. Stresses", 1, pp. 75-86.
  3. Chen, W. T., and Nelson, C., 1979, "Thermal Stresses in Bonded Joints", IBM J. Res. Dev., 23.2., pp. 179-188.
  4. Pagano, N. J., 1978, "Stress Fields in Composite Laminates", Int. J. Solids Struct., 14, pp. 385-400.
  5. Pagano, N. J., 1974, "On the Calculation of Interlaminar Normal Stress in a Composite Laminate", J. Compos. Mater., 8, pp. 65-82.
  6. Rehfield, L. W., and Valisetty, R. R., 1984, "A Simple Refined Theory for Bending and Stretching of Homogeneous Plates", AIAA J., 22.1., pp. 90-95.
  7. Suhir, E., 1986, "Stresses in Bi-Metal Thermostats", ASME J. Appl. Mech., 53, pp. 657-660.
  8. Suhir, E. 1986, "Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging", Elect. Pack. Mat. Science-II, MRS Symp. Proc., pp. 133-138.
  9. Suhir, E. 1986, "Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies", Int. Symp. Microelect., pp. 383-392.
  10. Suhir, E. 1987, "Stresses in Multilayered Thin Films on a Thick Substrate, Heteroepitaxy-on-Silicon II", MRS Symp. Proc, 91, pp. 73-80.
  11. Suhir, E. 1988, "An Approximate Analysis of Stresses in Multilayered Elastic Thin Films", ASME Winter Annual Meeting, WA/APM-14.
  12. Suhir, E., 1989, "Interfacial Stresses in Bimetal Thermostats", ASME J. Appl. Mech., 56, pp. 595-600.
  13. Pao, Y.H., and Eisele, E., 1991, "Interfacial Shear and Peel Stress in Multi-Layered Thin Stacks Subjected to Uniform Thermal Loading", ASME J. Electron. Packag., 113, pp. 164-172.
  14. Wen, Y., and Basaran, C., 2003, "Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging", ASME J., 125, pp.134-138.
  15. Valisetty, R. R., and Rehfield, L. W., 1983, "A Theory for Stress Analysis of Composite Laminates", AIAA Paper 83-0833-CP, 24thAIAA/ASME/ASCE/AHS Structures, Structural Dynamics, and Materials Conference, Lake Tahoe, NV.
  16. Basaran, C., and Zhao, Y., 2001, "Mesh Sensitivity and FEA for Multi-layered Electronic Packaging", ASME J. Electron. Packag., 123.3., pp. 218-224.
  17. O.C. Zienkiewicz, R.L. Taylor, and J.Z. Zhu, 2013 "The Finite Element Method: Its Basis and Fundamentals" Seventh Edition ISBN: 978-1-85617-633-0, Elsevier
  18. Autar K Kaw, 2006, "Mechanics of Composite Materials", Second Edition, CRC Taylor and Francis
  19. George Z. Voyiadjis, Peter I. Kattan, 2005, "Mechanics of Composite Materials with Matlab", Springer
  20. Ever J. Barbero, 2014, "Finite Element Analysis of Composite using Ansys", Second Edition, CRC Press, Taylor and Francis Group

International Journal of Scientific Research in Science and Technology

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Published

2018-05-05

Issue

Volume 5, Issue 3, May-June-2018

Section

Research Articles

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This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
Sanidhya Kumar Sanu, B K Karthik, Vijay Vittal, B Rammohan, " Development of Closed-Form Solution for a Multi-Layered Composite Stack Subjected to Thermal Loads, International Journal of Scientific Research in Science and Technology(IJSRST), Online ISSN : 2395-602X, Print ISSN : 2395-6011, Volume 5, Issue 3, pp.102-108, May-June-2018.