Adsorption mechanism of Cu(II) ion Removal from Aqueous Solution using Acid Activated Madhuca longifolia Stem

Authors

  • M. Elamaran  Research Department of Chemistry, Raja Serfoji Govt. College (AU) Thanjavur, TamilNadu, India
  • S. Arivoli  Research Department of Chemistry, Thiru Vi Ka Govt. Arts College, Thiruvarur, TamilNadu, India
  • N. Ingarsal  Research Department of Chemistry, Raja Serfoji Govt. College (AU) Thanjavur, TamilNadu, India
  • V Marimuthu  Department of Chemistry, Sir Issac Newton Arts and Science College, Nagapattinam, TamilNadu, India

Keywords:

Cu(II), AMLSC adsorbent, batch adsorption, adsorption isotherms, kinetics and Thermodynamics.

Abstract

The series of batch laboratory experiment were carried out by using Acid Activated Madhuca longifolia Stem Carbon for the removal of Cu (II) ions from aqueous solution by the adsorption process. The investigation was carried out by studying the influence of initial pH, contact time, adsorbent dosage and initial concentration of Cu(II). All batch experiment was carried out of constant temperature using wrist – action shaker that operated at 200 rpm. The single component equilibrium data was analyzed by Langmuir and Freundlich isotherms. Maximum adsorption of the Cu(II) ions, i.e. >90% has been achieved in aqueous solutions using 0.025g of AMLSC at a pH of 6.6. The kinetic process of Copper AMLSC was described by applying pseudo second order rate equation, Elovich model and intra- particles diffusion. The activated AMLSC investigated in this study carries high potential for the removal of Cu(II) ions from aqueous solution. The various thermodynamic parameters like ∆GO, ∆HO, and ∆SO and were analyzed to observe the nature of adsorption.

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Published

2015-12-25

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Research Articles

How to Cite

[1]
M. Elamaran, S. Arivoli, N. Ingarsal, V Marimuthu, " Adsorption mechanism of Cu(II) ion Removal from Aqueous Solution using Acid Activated Madhuca longifolia Stem, International Journal of Scientific Research in Science and Technology(IJSRST), Online ISSN : 2395-602X, Print ISSN : 2395-6011, Volume 1, Issue 5, pp.137-145, November-December-2015.